EXpressLO™ is a patented new grid design* and patent pending method that allows thin or thickex situ lift out specimens to be manipulated to a new grid design which does not require a carbon film such that the specimen may be further FIB milled, broad beam ion milled or plasma cleaned.
Why use ex situ lift out and EXpressLO™?
the fastest lift out procedure available
easy to learn, master, and teach
no carbon film on patented grid allows for further processing of specimen after manipulation
saves money (does not require expensive FIB time for lift out)
great for multi-user facilities
routine manipulation for backside thinning
supports multiple FIB instruments
the "technically correct" method for manipulation to special carriers used with in situ TEM specimen holders - fast with no FIB implantation damage!!!